B-spline based metamodel of the thermal analysis of the wire arc additive manufacturing process.

DS 122: Proceedings of the Design Society: 24th International Conference on Engineering Design (ICED23)

Year: 2023
Editor: Kevin Otto, Boris Eisenbart, Claudia Eckert, Benoit Eynard, Dieter Krause, Josef Oehmen, Nadège Troussier
Author: Zani, Mathilde (1); Montemurro, Marco (1); Panettieri, Enrico (1); Marin, Philippe (2)
Series: ICED
Institution: 1: Arts et Métiers Institute of Technology, Université de Bordeaux, CNRS, INRA, Bordeaux INP, HESAM Université, I2M UMR, F-33405 Talence, France; 2: Grenoble Alpes - Laboratoire G-SCOP UMR 5272, F-38000 Grenoble, France
Section: Design Methods
Page(s): 0807-0816
DOI number: https://doi.org/10.1017/pds.2023.81


Among additive manufacturing processes, wire arc additive manufacturing (WAAM) is one of the most promising methods for manufacturing complex near-net-shape parts, as it allows the layer-by-layer deposition of welded material at a high deposition rate. However, this technology is highly dependent on deposition conditions and thermomechanical phenomena during the process. Therefore, process simulation could be used to analyse the effects of different deposition parameters on the thermomechanical results to optimise the process. However, as the computing time required for this study may become prohibitive, a dedicated strategy is needed to reduce it while maintaining a good level of accuracy. In this study, only the thermal analysis of the process is investigated. An efficient metamodel based on B-spline entities is developed to emulate the thermal response of the WAAM process when building a mild steel four-layer wall structure. Thanks to B-spline entities, the temperature profile at different locations is approximated as a function of a subset of deposition parameters of WAAM process, and the results are compared with the simulated temperature profile resulting from a validation dataset.

Keywords: Additive Manufacturing, Industry 4.0, Simulation, Metamodel, B-spline

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